ANIKET ELECTROTECH SYSTEMS


Thermal Silicon Compound


Thermal Silicon Compound

Specifications

Application Industrial Use
Purity 90%
Usage Industrial
Packaging Type Jar
Packaging Size 1 kg
Applied in wide temperature range (-50 to 200 °C)
Appearance White paste
Penetration (25 °C, 1/10 mm) 340 to 360
Bleed (150 °C × 24 h) 1.0 Max %
Evaporation (200 °C, 8 h) 2.0 Max %
Thermal Conductivity 0.85 Min W/m·K
Thermal Resistance (0.3 mm, 80 psi) 13 °C·in2/W

Additional Information

Min. Order Quantity 20 Kilogram

Features :

  • Excellent insulation
  • Good thermal conductivity
  • Will not dry, harden and melt
  • Non-poison, odorless, non-corrosive
  • Compliance with RoHS Directive
  • Physical and chemical character stable

 

Applications :

  • Variable-frequency drives and induction cookers
  • TVs and DVDs
  • CPUs and amplifiers
  • Microwave communications and microwave transmission equipment
  • Power supplies and microwave devices
  • Transistors and semiconductors

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